Ceramic circuit board is the best shortcut to solve the lack of heat dissipation of cooling fins

Ceramic circuit board is the best shortcut to solve the lack of heat dissipation of cooling fins

Although the air-conditioning industry is facing adjustments, the demand for central air-conditioning and refrigerator industries from commercial buildings, public buildings and large villas is still in a growth period. In the short term, the area of newly-built commercial real estate is still growing rapidly, supporting 15% of central air-conditioning. The pressure for growth is very different; at the same time, the refrigeration industry will be driven by energy efficiency policies and import substitution. It is expected that the international refrigeration and air-conditioning equipment industry will usher in a round of rapid development in the next 10 years. Coupled with the further expansion of the cold chain market, the demand for refrigeration and air-conditioning equipment will increase, and the refrigeration industry has a bright future.

　　 However, if the refrigeration industry wants to start a diversified development, it must first find the bottleneck that restricts it. The biggest bottleneck in the air-conditioning equipment and refrigeration industry on the market is the insufficient cooling conditions for the hot surface by the cooling fins. As long as the cooling fin is energized for more than two seconds without heat dissipation, it will burn out, so heat dissipation is currently one of the first problems to be solved.

Refrigeration fins usually use its special material to dissipate heat. The use of hot-selling circuit boards in the refrigeration fins in the market does not bring much improvement to the refrigeration efficiency of the air conditioning and refrigeration industry. At this time, use ceramic substrates with strong heat dissipation. It is an inevitable choice to improve the quality of the product.

　　 There are currently four types of ceramic substrates on the market: thick-film ceramic substrates, low-temperature co-fired multilayer ceramics, and thin-film ceramic substrates and ceramic circuit boards made by LAM technology.

　　Thick Film Ceramic Substrate

　　 Thick film ceramic substrates are produced using traditional screen printing technology. Now the main manufacturers of thick film ceramic substrates in Taiwan are He Shentang, Jiuhao and other companies. Generally speaking, in the process of using screen printing to make the circuit, usually because of the problem of the network layout, the circuit is prone to rough and inaccurate alignment. Therefore, the accuracy of thick-film ceramic substrates has gradually ceased to be used for cooling fins with smaller and smaller size requirements in the future.

　　 low temperature co-fired multilayer ceramics

Low-temperature co-fired multilayer ceramic technology uses ceramics as the substrate material. The circuit is printed on the substrate by screen printing, and then the multilayer ceramic substrate is integrated. Finally, it is formed by low-temperature sintering. The main Taiwan manufacturer has Jingde Electronics, Fengxin and other companies. The metal circuit layer of the low-temperature co-fired multilayer ceramic substrate is also made by the screen printing process, which may also cause alignment errors due to the network problem. In addition, after the multilayer ceramic is laminated and sintered, the shrinkage ratio will also be considered .

　　 Thin Film Ceramic Substrate

　　In order to improve the problem of web opening during thick film manufacturing and the shrinkage ratio of multilayer laminates after sintering, thin-film ceramic substrates have recently been developed as heat sink substrates. The thin film heat dissipation substrate is made by sputtering, electro/electrochemical deposition, and yellow photolithography processes. At present, Taiwan's major companies such as ASP Electronics and Tongxin Electronics have the professional thin-film ceramic substrate production capacity.

　　LAM technology ceramic substrate

The advantages of the new LAM technology are not well known by the majority of people, but the ceramic circuit boards produced by LAM technology do not have to consider the problem of network expansion during the thick film manufacturing process and the shrinkage ratio after multilayer sintering, and the application of thin-film ceramic substrates The pollution caused by sputtering and electrochemical deposition process flow, so LAM technology not only solves the heat dissipation bottleneck problem, but also puts environmental protection work in the long-term plan ahead of time. Currently only Wuhan Zhongcheng 3D Electronics is using LAM technology to make ceramic circuit boards.

　　 Through the comparison of the above four ceramic substrates, it is obvious that the ceramic circuit board using LAM technology is more in line with the diversified and comprehensive development of the refrigeration industry in terms of heat dissipation and environmental protection.

　　 At present, the refrigeration sheet on the market requires stable voltage and good heat dissipation, and the thermal conductivity of the ceramic circuit board made by LAM technology and the material of the base material can meet the requirements of development. Therefore, the use of LAM technology to make ceramic circuit boards will become one of the important catalysts to promote the continuous improvement of high-power refrigeration sheets.